Recent developments in thermal management of light-emitting diodes LEDS A review

Abstract

Keywords: Life Span; Light Emitting Diode; Heat Pipe; Nanofluid; Thermal Management

Introduction

In many application fields, the thermal management of electronic components operating with high heat is a significant issue. The electronic application’s constant heat exchange and work recurrence are severe problems for the design of electronic components. Additional heat management from electronic components is required as the electronic structure

is curtailed. The current heat management system needs effective heat transfer using minimized design, particularly for cooling CPUs, LEDs, rectifiers, thyristors, semiconductors, traveling wave gatherers, sound and RF enhancers, and high-thickness semiconductors. It is crucial to enhance cooling since unwavering quality electronic parts are typically reactive to their working temperature.

*Corresponding author. *E-mail address: khudaiwala_ashish@gtu.edu.in This paper was recommended for publication in revised form by Editorin-Chief Ahmet Selim Dalkılıç Published by Yıldız Technical University Press, İstanbul, Turkey Copyright 2021, Yıldız Technical University. This is an open access article under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Light Emitting Diodes

Robust state semiconductor devices, the Light Emitting Diodes (LEDs), directly convert electrical energy into visible light. Kim et al. [1], represented that only 10 to 20% of the electrical power in flow-watt-level LEDs is converted to electro-optical energy; the other 80 to 90% is converted to heat. Since the surface area of a LED chip ranges from 1 mm2 to 2.5 mm2, it follows that the hotness dispersing change of an operational LED can achieve 100 W/cm2. The intersection temperature of LEDs should be kept under 110 °C for better to function correctly and have a long lifespan. Wang et al. [2], concluded that hotness dispersal coefficient should be more significant than 1 W/cm2/oC to provide a convenient expulsion of the hotness created. Since LEDs are hot light sources, heat radiation cannot account for much of how hotness is distributed. The key to effective LED thermal management is to plan an acceptable and skilled heat distribution strategy. Cooling Devices Major cooling devices for thermal management A passive device that uses the latent heat of working fluid vaporization to transport heat energy from the heating element

to the cooling element over a relatively long distance. Bumataria et al. [3], divided it in evaporator, adiabatic, and condenser sections comprise of three sub-sections, as shown in Figure 1 and a photocopy of the heat pipe is shown in Figure 2. Chavda [4], represented that the inner wall of the heat pipe is integrated with multiple structures comprising grooves, sintered powder, wire mesh, and fiber/spring. After achieving the requisite vacuum, the heat pipe is injected with the correct quantity of fluid and sealed. Many varying heat pipe configurations, such as cylinder-shaped heat pipes, flat heat pipes, thermosyphons, pulsating heat pipes, oscillating heat pipes, loop heat pipes, and rotating heat pipes, are seen in the open literature. Nanofluid Nanofluids are fluids with nanoparticles of metallic or non-metallic substance uniformly and steadily suspended (less than 100 nm in size). Bumataria et al. [5], concluded that the various nanoparticles in a variety of shapes, like spheroid and cylindrical, are developed by different chemical processes from metallic elements (Ag, Au, Cu, Fe), oxides (Al2O3, CuO, Fe2O3, Fe3O4, MgO, SiO2, TiO2), nitrides (AlN, SiN), carbides (SiC, TiC), and different kinds

Figure 1. Heat pipe. [From Bumataria et al. [3], with permission from Elsevier.].

of carbon (diamond, engine oil, ethylene glycol, graphite, refrigerants, and water are popular base liquids. Chavda et al. [6], concluded that the various base fluids can be combined with nanoparticles in different concentration ratios. Nevertheless, the incorporation of nanoparticles to improve the heat performance of heat pipes is highly dependent on variables such as the nanoparticles’ type, size, shape, concentration, and base liquid. Hybrid Nanofluid The possibility of enhancing thermal conductivity in single-component nanofluids has been proven in earlier investigations. However, advancement in the study area has been restricted due to the greater desire for superior thermal fluids characteristics. Al2O3, SiO2, and TiO2 are ceramic oxides of reduced thermal conductivity than copper, gold, silver, or carbon compounds. Akilu et al. [7], studied that due to considerably higher mass density, pure metals such as Ag and Cu and oxides such as CuO form more effectively than other oxides such as Al2O3. In recent decades, nanofluids’ low thermal conductivity and integrity issues have been rectified by integrating more than one material nano-additives to obtain a synergetic effect, a composite/ hybrid nano-additive. The suspending, characterized as a “hybrid nanofluid,” incorporates hybrid nano-additives that boost thermal conductivity and stability, promoting the conduction of heat. Many researchers have been focusing on thermal management to extend the life of electronic components, mainly LEDs, because of how extensively used LEDs are in public and private places. One of the forces influencing the immediate need for development is the untimely failure of LEDs caused by high junction temperatures, which leads to motivation for the thermal management of LEDs with compact, low-cost, and high-performance cooling systems. To analyze various research trends for thermal management of LEDs, solar stills, electric vehicles, and different heat transfer devices using heat pipes, thermoelectric coolers (TEC), modified heat sinks, ionic wind, fins, and spray cooling, among other devices. The methodology employed for this article contains an introduction related to the essential term, a critical review of the literature, a comparative analysis, a critique outcome of the literature, future scope, and statistical analysis to prove the current scenario. At the paper’s end, the literature review recommendations have been drawn as a conclusion.

Literature Study

Review of Literature Related to Various Thermal Management Systems Used for Leds [A] Heat pipe Kim et al. [8] studied enhancement in heat transfer with nanofluids in a pulsing heat pipe for LED lighting heat dissipation. The experiment’s results revealed that a diamond

nanofluid with a 5% convergence increased heat transfer by 18% compared to pure water. Compared to pure water, the Al2O3 nanofluid’s 0.5% concentration demonstrated a 24% increase in heat transmission rate. Tang et al. [9] investigated high-power LEDs with chips directly attached to heat pipes. They have determined that at 2800 mA, the thermal conductivity of the CHP lead frame is 0.23 °C/W and 1.65 °C/W. The CHP lead frame LED device’s iridescent efficiency is 66.23 m/W at 2800 mA. It is 19.2% more expensive than the standard copper-lead frame. The CHP lead frame’s correlated color temperature (CCT) shift value is 108 oC (381 K), which is 23.5% lower than the copper lead frames. Zheng et al. [10] analyzed a high-power LED lighting system with heat pipe cooling; it was discovered that while cooling with fins, the temperature of the LED substrate reaches 40 oC in about 5 minutes. However, when using a combination of a fan and heat pipe to cool, the working temperature is just 25 °C. Wang et al. [2] studied Highpower LED cooling using a SiO2 nanofluid screen mesh and wick heat pipe. It was revealed that the thermal resistance of the heat pipe employing SiO2 nanofluid as the working liquid is 35–40% less than that of purified water at a heat load of 1–60 W heat load. Wang et al. [11] investigated that when the input power was 60 W, and the corresponding maximum LED temperature was maintained below 70 °C, the heat transfer performance of a novel tubular oscillating heat pipe with sintered copper particles inside a flat-plate evaporator and high-power LED heat sink application showed the lowest thermal resistance of 0.168 K/W. Bhullar et al. [12] augmented the thermal performance of a straight heat pipe with an annular screen mesh wick and surfactant-free stable aqueous nanofluids. Using 1 v% of Al2O3/DI nanofluids at a low heat input of 12 W, the trial results indicate an ideal reduction of 22 % in the thermal resistance value compared to DI water. Gunnasegaran et al. [13] investigated the Diamond-H2O nanofluid in the loop heat pipe to transmit heat. According to test results, the thermal resistance of LHP decreased on average by 5.7 wt% to 10.8 wt% when nanoparticle mass concentrations ranged from 0.5 wt% to 3 wt% compared to pure water. Kahani et al. [14] analyzed an artificial neural network, thermal performance of a wickless heat pipe with Al2O3/water nanofluid was predicted. It was established that the percentages of pure water and

9. W to 12 W. A massive temperature drop of 61.3 °C was

observed as a result of improved evaporation. Khandekar et al.[31], studied High-power LED cooling with liquid sprays: problems and potential solutions. The temperature control of high-power LED sources demonstrated a thorough review of flow and heat transport during the impingement of liquid jets on heated surfaces. Cengiz et al. [32] examined heat transfer characteristics of high flux LED and

Figure 3. 3D animation of an experimental setup for LED cooling. [From Hsieh et al. [29], with permission from Elsevier.]

concluded that recent findings provide an excellent foundation for intelligent control of phosphor particles to improve the thermal and optical characteristics of both RGB and white LED bundles. Sevlgen et al. [33] experimented with dual-separated cooling channel performance evaluation for high-power led PCB in the vehicle headlight resulted in a temperature reduction of up to 50% on the top copper surface contact with a single LED chip and a 36% reduction in junction temperature. The luminance of the light produced was also increased by about 10%. Gatapova et al. [34] studied a single-phase liquid jet array for controlling the temperature of high-power LED modules. The tests show that substrate-level heat flow may be maintained up to 125 W/ cm2 while keeping the module surface temperature below 70 °C. Summary of research work related to spray cooling utilized LED thermal management system is compared and presented in Table 4. [E] Fins Zhao et al. [35] explained the design and analysis of the thermal model of the high-power LED automobile headlight cooling device. The results show that the heat sink cooling framework’s thermal performance is inferior to the heat sink’s thermal performance with HCPS. Additionally, 47 mm is the appropriate length for the HCPS. Additionally,

the junction temperature dropped from 116.61 °C to 78.05 °C due to the enforced velocity airflow that was put into place. Huang et al. [36] studied the purpose of removing the heat from powerful automobile LED headlights, and fins with a grooved heat pipe have been designed. The suggested model demonstrated that combining 76 mm-long grooved heat pipes with an effective thermal conductivity of 6000 W/mK and 2 mm-long plate heat dissipation fins on the heat sink with an AlN ceramic having a 180 W/mK proved effective in dissipating heat from high-powered LED headlights within a severely constrained space. Yang et al. [37] focused on developing the thermal conductive composite annular fins to improve the heat transfer of quantum dots in LEDs. The most crucial surface operating temperature of LEDs was found to be 20 °C lower at 1000 mA. The LEDs also displayed a fantastic optical display, boasting a high CRI of 90.3 and a high luminance performance. The summary of research related to fins utilized LED thermal management system is compared and presented in Table 5. [F] Ionic winds Wang et al. [38] studied the ionic wind thermal control of high-power light-emitting diodes. When the mesh density was 20 in. and the discharge gap was 5 mm, the ionic wind behaved best; its maximum speed was 1.75 m/s. Shin

Table 4. Summary of research work related to spray cooling utilized LED thermal management system Literature

The temperature was able to remain below 115 C at 2.8 W LED heat.

Working medium- DI water Nozzle diameter: 35 µm Flow rate:0.53 (ml/s)

2014 A single spray’s typical heat transfer coefficient (h) is the highest at 9375 W/m2 oC and the lowest at 2 oC/W.

At 9 W to 12 W heat input, the temperature retarded by 61.3 oC, and illuminance was enhanced by 25%.

Orifice dia.:0.594, flow rates:390 ml/min, Reynold Number: 1600 pressure drop: 8 bar

Spray cooling makes better thermal management 2019 for high-power LEDs.

Findings provide a strong foundation for intelligent control of phosphor particles to improve the thermal and optical characteristics of both RGB and LED bundles.

Flow rate:0-30 l/min temperature: -20 to120 °C mass flow rate: 0.0002 kg/s to 0.005 kg/s

The temperature plummeted by up to 50% by the 2021 time it was over, while the junction temperature dropped by 36%. The luminance of the light produced was also increased by about 10%.

Jet dia.:400 μm pressure:0-8 bar flow rates: 65 ml/min to 782 ml/min

2021 According to the results, it may be possible to maintain a substrate-level heat flow of up to 125 W/cm2 while keeping the surface temperature of the module well below 70 °C.

Table 5. Summary of research work related to fins utilized LED thermal management system Literature

The junction of temperature was retarded from 116.61 oC to 78.05 oC.

The proposed model effectively dissipated heat from LED to the atmosphere.

QDs-AF: 4 fins Thickness:0.28 mm, the mass concentration of hBNs: 15 wt%.

The surface working temperature of LEDs was decreased by 20 °C at 1000 mA. Also, the LEDs demonstrated an incredible optical exhibition with a high CRI of 90.3 and a high luminous performance of 124.1 lm W−1.

Table 6. Summary of research work related to ionic winds utilized LED thermal management system Literature

Ionic wind generator: Maximum ionic wind velocity was 1.75 m/s 2017 Wire (d×l): (0.15/0.4 /0.6) ×100 when the mesh density was 20 inches, and the mm Maximum ionic wind discharge gap was 5 mm. velocity was 1.75 m / sec when the mesh density was 20 inches, and the discharge gap was 5 mm. Needle(r×l): (80/480 /1000 µm) × 30 mm Net: 100 × 100 mm

Ionic wind generator: Wire (diameter × length) : (0.5mm/0.4 mm/) × 100 mm The thickness of Fin:5mm

The ionic wind raised the heat transfer coefficient of the heat sink by 37%, from

1. High-wattage light-emitting diodes are currently the

most common choice in lighting applications such as street lights, stadiums, and high mast towers.

2. The most well-known methods for LEDs and other

electronic components are conventional air cooling, fin cooling, spray cooling, heat pipes, thermoelectric cooling, and ionic winds. Heat pipes were the best alternative when it came to the thermal management of LEDs. 3. As proven, using mono & hybrid nanofluids as a working liquid can significantly improve the thermal performance of a heat pipe.

4. A limited number of researchers have examined the

thermal performance of nanofluid-filled heat pipes to cool electronic components such as electric vehicle batteries, central processing units (CPUs), electric heaters, and LEDs, among other things.

5. Numerous studies have been conducted with significant

attention to the various types of heat pipes, nanoparticles, base fluids, percentage concentrations, particle sizes, heat pipe orientations, and application types.

7. Use of PCM in LED cooling might increase fire risk,

flame spread, smoke, potential for explosion when held in containers, and liability, it may be wise not to use flammable PCMs for LED cooling at residential or other regularly occupied buildings.

8. Apart from electronic component cooling, mono, as

well as hybrid nanofluid, can be utilized in automobile radiators [104], solar distillation systems [105], solar collectors, cutting fluid, solar heaters [106], and energy storage systems [107]. The comparative study of works related to LED cooling systems using nanofluid-filled heat pipes is presented in Table 12. The analysis suggests the optimistic hope for thermal management of LED using nanofluid-filled heat pipes due to lower cost, higher heat carrying capacity, and compactness. Statistical Analysis This paper examines several thermal management approaches for LEDs and heat pipes as thermal management tools for various electrical devices. Various parts of the review work conducted over the past decade are recognized, including performance characteristics, experimental

Table 12. Comparative study of various work related to LED cooling using nanofluid filled heat pipe Literature

analysis, thermal management system description, and working fluids. Significant Elsevier, Taylor & Francis, and Springer publications, as well as a conference proceeding, are the primary sources for the cited works in this article. The total number of works published in various categories is shown in Figure 4. More research articles on experimental work in heat management systems have been published throughout the previous decade. Due to the non-linear and complex performance tend of the heat pipe, and temperature gradient of LED, the numerical analysis, mathematical model, and CFD work is less in this field. The number of publications between 2012 and 2022 is shown in Figure 5. The trend implies that the research trends have been current and acceding since the last decade. It was concluded that more articles would be produced in 2021. The number of scholarly articles utilizing specific types of thermal management systems for LEDs is displayed in Figure 6. As indicated in Figure, the most significant number

Figure 4. Publications on the nature of work for thermal management systems.

of LED thermal management researchers employed heat pipes and modified heat sinks. The primary usage of heat pipe as a thermal management device shows a favorability as a cooling system due to compactness, high heat carrying capacity, and lower cost. The number of published research employing heat pipes as a thermal management technique for various thermal devices is demonstrated in Figure 7. According to the Figure, most researchers used nanofluid-filled heat pipes to control various thermal devices. A recent innovation in thermal management utilizes nanofluid-filled heat pipes. A hybrid nanofluid-filled heat pipe is the most prevalent way to get the synergistic effects of individual nanoparticles nowadays. Current research suggests a nanofluid-filled hybrid hat pipe to regulate thermal devices. Future Trends The previous section could be able to forecast where LED thermal management systems stand in terms of research right now. This section discusses a potential line of inquiry toward a new thermal management system for LEDs.

Figure 6. Number of studies and types of thermal management methods for LEDs.

Figure 7. Number of studies as well as working medium types and their application. Due to their ease of assembly, handling, installation, and low power consumption, LEDs are frequently utilized in commercial and residential applications, including stadiums, high mast towers, and street lights. Substantial research has been done on nanofluid-filled heat pipes for the thermal control of LEDs. The change in LED performance for changing heat loads, ideal orientation, and application types using heat pipes as a thermal management system can be the subject of future research. As a working medium-filled heat pipe, traditional mono nanofluid has been the subject of much research for the thermal management of heat transfer devices. Particularly for

practical applications such as LEDs cooling, there has been little research on the application of hybrid nanofluid and the comparison of hybrid nanofluid to nanofluid wherein individual nanoparticles was suspended. The published research works pertain to nanofluid types, wick structure types, nanoparticle concentration, filling ratio, orientation, and heat load. When applied in actual applications, hybrid nanofluids might be used to undertake an extensive study into the effect of varied, suspended nanoparticles, suspended particle, percentage concentration, filling ratio, surface shape, and preparation method on the thermal performance of heat pipes.

The thermal management of heat transfer devices has been the subject of much research utilizing a heat pipe filled with mono nanofluid as a working medium. Particularly for practical applications such as LED cooling, there has been limited research on the usage of hybrid nanofluid and the comparison of hybrid nanofluid to nanofluid in which individual nanoparticles were suspended. The published research addresses many topics, including nanofluid types, wick structure types, nanoparticle concentration, filling ratio, orientation, and heat load. Using hybrid nanofluids, researchers can examine the effect of different suspended nanoparticles, their proportion, concentration, filling ratio, surface shape, and preparation technique on the thermal performance of heat pipes, especially for practical applications.

Conclusion

This paper explored the thermal management of LEDs and heat pipes as a thermal management system for thermal devices employing nanofluids, both mono, and hybrid, as a medium for work. Open literature indicates that mono and hybrid nanofluid-filled heat pipes have excellent promise for LED thermal management. From the study, the following findings can be drawn:

1. High-wattage LEDs are now most prevalent in lighting

applications like Street lights, Stadiums, and High mast towers. Reducing LED’s life span due to the overheating problem needs attention.

4. Limited researchers have used a combination of more

than one nanoparticle in base fluid with various proportions to investigate the heat pipe for actual life application.

5. Due to the complex and non-linear performance trend

of LED cooling, experimental work is needed to be carried out for the thermal management of LEDs.

6. Increased heat transfer at the evaporator section of a

heat pipe made of nanofluids may result from (1) bombardments of suspended nanoparticles that create more vapor bubbles and reduce their size and number, (2) improvements in the thermophysical properties of the working medium, such as thermal conductivities, and (3) an artificial layer of nanoparticles on the surface of the wall that increases the heat transfer coefficient and heat flux. As a result of the deposition of nanoparticles on the surface, a porous structure is created, which increases the surface area for heat transfer.

7. Adopting a working medium composed of hybrid

nanoparticles is essential to enhance heat transfer rate and stability while decreasing viscosity due to the synergistic impact.

In addition, theoretical and experimental research is required to comprehend the thermal management of LEDs employing hybrid nanofluid-filled heat pipes for diverse applications such as street lights, stadiums, and high mast towers.

Abbreviations

Ag Silver Aluminium Oxide Al2O3 AlN Aluminum Nitride Au Gold CCT Correlated Colour Temperature CHP Closed Loop Heat Pipe CHS Conventional Heat Sink CNT Carbon Nanotube CPU Central Processing Unit CRI Colour Rendering Index Cu Copper CuO Copper Oxide

Dasptc

Direct Absorption Solar Trough Collector DLC Diamond-Like Carbon EV Electric Vehicle Fe2O3/Fe3O4 Iron Oxide HCPS Heat Conductive Plates

Ihsvc

Integrated Heat Sink with Vapour Chamber LED Light Emitting Diode LHP Loop Heat Pipe MgO Magnesium Oxide MHS Micro-channel Heat Sink

Mwcnt

Multi-Wall Carbon Nanotube NP Nano Particles PCM Phase Change Material PHP Pulsating Heat Pipe SiC Silicon Carbide SiN Silicon Nitride SIN Silicon Nitride Silicon Oxide SiO2 TEC Thermo-Electric Cooler TiC Tungsten Carbide Titanium Oxide TiO2 TMS Thermal Management System Symbol HTC T v wt

Heat Transfer Coefficient (W/mK) Temperature (oC) Volume Fraction (%) Weight Fraction (%)

Data Availability Statement

The authors confirm that the data that supports the findings of this study are available within the article. Raw data that support the finding of this study are available from the corresponding author, upon reasonable request.

Conflict Of Interest

The author declared no potential conflicts of interest with respect to the research, authorship, and/or publication of this article.

Ethics

There are no ethical issues with the publication of this manuscript.

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